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TrendForce, a world leading market intelligence provider, covers various research sectors including DRAM, NAND Flash, SSD, LCD display, LED, green energy and PV. The company provides the most up-to-date market intelligence, price survey, industry consulting service, business plan and research report, giving the clients
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News
[News] SanDisk Reportedly Hunts for HBM, LPDDR Talent in Korea as AI Memory Race Heats Up
19+ hour, 59+ min ago (318+ words) A new contender is entering South Korea’s already fierce chip talent war. According to Newsis and EDAILY, U.S.- headquartered NAND and SSD maker SanDisk is hiring across multiple roles in the country, with expertise in key memory technologies such as…...
[News] Inside iPhone 18 Pro and Duo: A20 Pro Debuts as Apple’s 1st 2nm Chip in iPhone, Duo Trades RAM for Storage
4+ day, 8+ hour ago (676+ words) John Ternus took the stage for his first iPhone launch as CEO following Tim Cook’s departure, putting the iPhone Duo, and the new iPhone 18 Pro and Pro Max in the spotlight. Among the key announcements was Apple’s A20 Pro, which powers…...
[News] Huawei Reportedly Backs China’s DUV Drive, with 12 Systems Targeted by End-2026; SMIC Testing Underway
6+ day, 4+ hour ago (393+ words) TrendForce TrendForce News operates independently from our research team, curating key semiconductor and tech updates to support timely, informed decisions. [News] Huawei Reportedly Backs China’s DUV Drive, with 12 Systems Targeted by End-2026; SMIC Testing Underway Huawei is emerging as a…...
[News] SK hynix’s China eSSD Business Hits Turning Point as Intel NAND Deal Restrictions Near Expiry by End-2026
1+ week, 5+ day ago (330+ words) As the memory boom drives prices higher across DRAM, NAND and end-products, SK hynix is approaching a key growth inflection point: China’s five-year restrictions on its enterprise SSD (eSSD) business are set to reach a turning point at the end…...
[News] SK hynix Reportedly Weighs Japan Memory Plant; U.S. Pressure, Korean Approval Could Complicate Plans
1+ week, 5+ day ago (482+ words) TrendForce TrendForce News operates independently from our research team, curating key semiconductor and tech updates to support timely, informed decisions. [News] SK hynix Reportedly Weighs Japan Memory Plant; U.S. Pressure, Korean Approval Could Complicate Plans SK hynix’s potential memory investment in…...
[News] Intel’s Advanced Packaging, Led by EMIB-T, Set to Hit Its Stride in 2029; DRAM Manufacturing Ruled Out
2+ week, 11+ hour ago (258+ words) Memory was another key topic at the conference, as AI reshapes the strategic importance of memory. Tom’s Hardware previously reported that Intel CEO Lip-Bu Tan had hinted at a potential return to the memory market. Zinsner, however, clarified that Intel…...
[News] Powertech Bets NT$70B on World’s First Panel-Level AI Chip Packaging in 2027, Potentially Ahead of TSMC
2+ week, 11+ hour ago (477+ words) [News] Powertech Plans NT$70B Push for World’s First Panel-Level AI Chip Packaging in 2027, Potentially Ahead of TSMC TrendForce TrendForce News operates independently from our research team, curating key semiconductor and tech updates to support timely, informed decisions. [News] Powertech Bets…...
[News] Apple Unveils M6, Its First 2nm Chip Built by TSMC, With 30% AI GPU Compute Boost vs. M5
2+ week, 5+ day ago (347+ words) Apple is pushing its silicon lineup further with new chips aimed at boosting performance and on-device AI capabilities. According to its press release, Apple debuted the M6 in the new Mac mini and the M5 Ultra in the new Mac Studio. NewsPim…...
[News] NVIDIA’s Reported 15% Server Hike Boosts Samsung, SK hynix, With HBM Prices Potentially Up 50%+ in 2027
2+ week, 6+ day ago (228+ words) The pricing momentum is expected to span the full HBM lineup, from HBM3e to HBM4 and HBM4e, Bloter suggests. UBS, cited by the report, offers an even more bullish outlook, saying HBM4 and HBM4e pricing is proving much stronger than initially expected and projecting 2027 HBM…...
[News] Marvell, AMD Reportedly Shake Up Google TPU Race, Putting Broadcom, MediaTek Under Pressure
3+ week, 4+ day ago (275+ words) The battle for custom AI chips is heating up, with two heavyweight chipmakers—Marvell and AMD—potentially joining the race for Google’s next-generation Tensor Processing Units (TPUs). AMD could also be entering the fray. As eported by Tom’s Hardware, citing…...