13+ hour, 51+ min ago   (281+ words) As the AI boom strains supply and pushes up costs, startups are exploring new ways to expand memory production. According to TechPowerUp, Kepler Computing claims to have developed an alternative approach to HBM based on a new 3D stacking technique and…...

22+ hour, 45+ min ago   (318+ words) A new contender is entering South Korea’s already fierce chip talent war. According to Newsis and EDAILY, U.S.- headquartered NAND and SSD maker SanDisk is hiring across multiple roles in the country, with expertise in key memory technologies such as…...

4+ day, 5+ hour ago   (461+ words) TrendForce TrendForce News operates independently from our research team, curating key semiconductor and tech updates to support timely, informed decisions. [News] Chinese AI Chipmakers Reportedly Hike Prices on HBM Costs, Huawei 950DT Up as Much as 50% Rising memory costs are adding…...

4+ day, 11+ hour ago   (676+ words) John Ternus took the stage for his first iPhone launch as CEO following Tim Cook’s departure, putting the iPhone Duo, and the new iPhone 18 Pro and Pro Max in the spotlight. Among the key announcements was Apple’s A20 Pro, which powers…...

6+ day, 11+ hour ago   (226+ words) TrendForce TrendForce News operates independently from our research team, curating key semiconductor and tech updates to support timely, informed decisions. Samsung had outsourced PIC wafer validation to external organizations, including Belgian semiconductor research institute imec, since last year. It has…...

1+ week, 14+ hour ago   (369+ words) As AI workloads demand ever more memory, DRAM’s physical capacity ceiling is becoming the bottleneck. At a September 3rd briefing, Japan’s NAND giant detailed how its CXL memory modules expand usable memory capacity while cutting latency by over 90% versus conventional approaches,…...

1+ week, 5+ day ago   (330+ words) As the memory boom drives prices higher across DRAM, NAND and end-products, SK hynix is approaching a key growth inflection point: China’s five-year restrictions on its enterprise SSD (eSSD) business are set to reach a turning point at the end…...

2+ week, 14+ hour ago   (258+ words) Memory was another key topic at the conference, as AI reshapes the strategic importance of memory. Tom’s Hardware previously reported that Intel CEO Lip-Bu Tan had hinted at a potential return to the memory market. Zinsner, however, clarified that Intel…...

2+ week, 5+ day ago   (450+ words) TrendForce TrendForce News operates independently from our research team, curating key semiconductor and tech updates to support timely, informed decisions. [News] Samsung’s 4nm GAIA Could Mark First PIM Commercialization in AI PCs, Mass Production as Early as 2027 Samsung is exploring a…...

2+ week, 5+ day ago   (431+ words) According to Tom’s Hardware, each Jalapeño package combines its compute die with six HBM4 stacks, delivering 216 GiB of memory and 15.4 TB/s of bandwidth. By comparison, NVIDIA’s GB300 features 288GB of HBM3e and carries a 1,400W power rating, the report notes, adding that on a…...