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News
[News] Kepler Claims HBM Alternative Without EUV Using GlobalFoundries’ 28nm Fabs, 2027 Production
6+ hour, 52+ min ago (281+ words) As the AI boom strains supply and pushes up costs, startups are exploring new ways to expand memory production. According to TechPowerUp, Kepler Computing claims to have developed an alternative approach to HBM based on a new 3D stacking technique and…...
[News] SanDisk Reportedly Hunts for HBM, LPDDR Talent in Korea as AI Memory Race Heats Up
15+ hour, 45+ min ago (318+ words) A new contender is entering South Korea’s already fierce chip talent war. According to Newsis and EDAILY, U.S.- headquartered NAND and SSD maker SanDisk is hiring across multiple roles in the country, with expertise in key memory technologies such as…...
[News] NVIDIA’s DLSS 5 Could Boost Graphics DRAM Demand, With GDDR6 Prices Reportedly Already Triple
4+ day, 7+ hour ago (281+ words) NVIDIA, already a major memory buyer through its AI accelerators, is tightening memory supply and extending its impact beyond HBM. According to Chosun Biz, the chip giant’s latest neural rendering technology, DLSS 5, is raising the performance bar for PC gaming…...
[News] OpenAI Says It Is Working with Samsung on Next-Gen Chips; Ties Could Expand Beyond Memory
4+ day, 23+ hour ago (248+ words) OpenAI is pushing deeper into custom AI silicon, and Samsung may be playing a growing role in its chip ambitions. According to Reuters, Harrison Kim, General Manager of OpenAI Korea, said the two companies have made significant progress in working…...
[News] Samsung Reportedly Eyes In-House Silicon Photonics PIC Testing by End-2026 with TSMC-Qualified Tools
6+ day, 4+ hour ago (226+ words) TrendForce TrendForce News operates independently from our research team, curating key semiconductor and tech updates to support timely, informed decisions. Samsung had outsourced PIC wafer validation to external organizations, including Belgian semiconductor research institute imec, since last year. It has…...
[News] Kioxia Reportedly to Sample CXL Modules Soon, Reaffirms Strong NVIDIA CMX Ties
1+ week, 7+ hour ago (369+ words) As AI workloads demand ever more memory, DRAM’s physical capacity ceiling is becoming the bottleneck. At a September 3rd briefing, Japan’s NAND giant detailed how its CXL memory modules expand usable memory capacity while cutting latency by over 90% versus conventional approaches,…...
[News] SK hynix Reportedly Weighs Japan Memory Plant; U.S. Pressure, Korean Approval Could Complicate Plans
1+ week, 5+ day ago (482+ words) TrendForce TrendForce News operates independently from our research team, curating key semiconductor and tech updates to support timely, informed decisions. [News] SK hynix Reportedly Weighs Japan Memory Plant; U.S. Pressure, Korean Approval Could Complicate Plans SK hynix’s potential memory investment in…...
[News] NVIDIA’s First Investment in a Taiwan-Listed Firm in Spotlight: What the MediaTek Deal Means for the AI Race
1+ week, 6+ day ago (411+ words) The five-year bonds carry a 0% coupon rate and have an initial conversion price of NT$4,513.75 per MediaTek share, representing a 15% premium to the closing price on the pricing date, Commercial Times notes, adding if all bonds are converted at the…...
[News] Intel’s Advanced Packaging, Led by EMIB-T, Set to Hit Its Stride in 2029; DRAM Manufacturing Ruled Out
2+ week, 7+ hour ago (258+ words) Memory was another key topic at the conference, as AI reshapes the strategic importance of memory. Tom’s Hardware previously reported that Intel CEO Lip-Bu Tan had hinted at a potential return to the memory market. Zinsner, however, clarified that Intel…...
[News] Samsung’s 4nm GAIA Could Mark First PIM Commercialization in AI PCs, Mass Production as Early as 2027
2+ week, 5+ day ago (450+ words) TrendForce TrendForce News operates independently from our research team, curating key semiconductor and tech updates to support timely, informed decisions. [News] Samsung’s 4nm GAIA Could Mark First PIM Commercialization in AI PCs, Mass Production as Early as 2027 Samsung is exploring a…...